Title :
A Design and Packaging Technique for a High-Gain, Gigahertz-Band Single-Chip Amplifier
Author :
Akazawa, Yukio ; Ishihara, Noboru ; Wakimoto, Tsutomu ; Kawarada, Kuniyasu ; Konaka, Shinsuke
fDate :
6/1/1986 12:00:00 AM
Abstract :
Equalizing amplifiers for gigabit optical fiber transmission systems requires a 65-dB gain (S21) with a gigahertz bandwidth. However, this gain has the potential to cause significant parasitic oscillation. Consequently, developing a useful stabilization design technique is a very important factor in attaining practical design. In this paper, stabilization design techniques are described for circuit configurations, packaging, and stability assessment. In addition, fabrication results of amplifier IC based on bipolar super self-aligned process technology (SST) and new wide-band high isolation package with coaxial-like 50-Ω signal lines are also shown. A 65-dB gain, 1.3-GHz bandwidth single-chip amplifier has been successfully fabricated.
Keywords :
Broadband amplifiers; Monolithic integrated circuits; Packaging; Bandwidth; Bipolar integrated circuits; Broadband amplifiers; Circuit stability; Fabrication; Optical amplifiers; Optical fiber amplifiers; Optical fibers; Packaging; Semiconductor optical amplifiers;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.1986.1052544