DocumentCode
900745
Title
Optimal pulse shaping for plasma processing
Author
Vincent, Tyrone L. ; Raja, Laxminarayan L.
Author_Institution
Div. of Eng., Colorado Sch. of Mines, Golden, CO, USA
Volume
12
Issue
1
fYear
2004
Firstpage
75
Lastpage
86
Abstract
Thin-film etching and deposition using low-pressure plasma reactors is an integral part of the fabrication of very-large-scale integrated (VLSI) circuits. Standard operation of plasma reactors uses an RF power source with constant average power to excite a plasma in the vacuum chamber. Recently, several researchers have shown empirically that operation of plasma reactors with a periodic power input has the promise to increase the flexibility of plasma processing, in the sense that a greater range of operating conditions is achievable. This paper presents a numerical analysis of a global model for an argon plasma with the aim of answering the following questions: First, can a periodic input achieve effective operating conditions that cannot be achieved using steady-state inputs? Second, if the answer to the first question is yes, what is the shape of the periodic input required to achieve a particular operating point? This technique was utilized to give answers to these questions in one particular case. It was shown that periodic operation of an argon plasma can create variations in the ratio of metastable argon density to ionized argon density beyond that achievable using constant power. In addition, strong evidence is given that arbitrarily shaped modulating waveforms have advantages over simple pulse width modulation.
Keywords
VLSI; argon; etching; integrated circuit manufacture; optimal control; periodic control; plasma materials processing; pulse shaping circuits; pulse width modulation; thin films; Ar; RF power source; VLSI circuit; argon plasma; low pressure plasma reactor; metastable argon density; optimal pulse shaping; plasma processing; pulse width modulation; shaped modulating waveforms; steady state inputs; thin film deposition; thin film etching; very large scale integrated circuit; Argon; Etching; Inductors; Plasma applications; Plasma materials processing; Plasma sources; Pulse shaping methods; Pulse width modulation; Sputtering; Thin film circuits;
fLanguage
English
Journal_Title
Control Systems Technology, IEEE Transactions on
Publisher
ieee
ISSN
1063-6536
Type
jour
DOI
10.1109/TCST.2003.821961
Filename
1268053
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