Title :
Designing Reliability into High Power Linear ICs
Author :
Fumagalli, Walter
Author_Institution :
Head of Packaging Development SGS-ATES SpA
fDate :
5/1/1975 12:00:00 AM
Abstract :
Two parallel paths have been followed in the development of power linear ICs. One aspect has been the development of circuit designs and fabrication technologies capable of combining small signal and power output stages on a single chip.
Keywords :
Current density; Fabrication; Feedback; Frequency; Geometry; Metallization; Packaging; Plastics; Power integrated circuits; Power transistors;
Journal_Title :
Consumer Electronics, IEEE Transactions on
DOI :
10.1109/TCE.1975.266692
