DocumentCode
901247
Title
Designing Reliability into High Power Linear ICs
Author
Fumagalli, Walter
Author_Institution
Head of Packaging Development SGS-ATES SpA
Issue
2
fYear
1975
fDate
5/1/1975 12:00:00 AM
Firstpage
140
Lastpage
154
Abstract
Two parallel paths have been followed in the development of power linear ICs. One aspect has been the development of circuit designs and fabrication technologies capable of combining small signal and power output stages on a single chip.
Keywords
Current density; Fabrication; Feedback; Frequency; Geometry; Metallization; Packaging; Plastics; Power integrated circuits; Power transistors;
fLanguage
English
Journal_Title
Consumer Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0098-3063
Type
jour
DOI
10.1109/TCE.1975.266692
Filename
4042754
Link To Document