Title :
Embedded IC and high-Q passives technology for ultra-compact Ku-band VCO module
Author :
Pinel, S. ; Lee, Chia-Han ; Yoon, S.-W. ; Nuttinck, S. ; Lim, Khan ; Laskar, J.
Author_Institution :
Yamacraw Design Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We present a novel ultra-compact embedded IC integration approach for system-on-package (SOP) based solutions for RF and wireless communication applications. This concept is applied to the integration of a Ku band VCO module. The module fabrication is described and the impact of the packaging on the chip-set performances is discussed. The final thickness of the module is about 150 μm. The embedded VCO exhibits an oscillation frequency of 15.4 GHz, a phase noise of -99.2 dBc/Hz at a 1 MHz offset and maximum output power of 10.67 dBm. Multilayer interconnects built with modified MCM-D technology using advanced photosensitive epoxy Intervia 8000 is described. Characterization and modeling of RF inductors are detailed and show quality factor as high as 80 at 10 GHz.
Keywords :
integrated circuit interconnections; integrated circuit packaging; microwave integrated circuits; multichip modules; system-on-chip; voltage-controlled oscillators; 10 GHz; 15.4 GHz; Intervia 8000; MCM-D technology; RF communication; RF inductors; chip packaging; chip-set performances; embedded IC; high-Q passives technology; multilayer interconnects; oscillation frequency; output power; phase noise; photosensitive epoxy; quality factor; system-on-package; ultra-compact ku-band VCO module; wireless communication; Application specific integrated circuits; Fabrication; Nonhomogeneous media; Packaging; Phase noise; Power generation; Radio frequency; Radiofrequency integrated circuits; Voltage-controlled oscillators; Wireless communication;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2003.818529
