DocumentCode
901723
Title
Wideband package using an electromagnetic absorber
Author
Iwasaki, Naoki ; Katsura, Kenshiro ; Kukutsu, Naoya
Author_Institution
NTT Interdisciplinary Research Labs., Tokyo, Japan
Volume
29
Issue
10
fYear
1993
fDate
5/13/1993 12:00:00 AM
Firstpage
875
Lastpage
876
Abstract
A novel wideband and resonance-free package is proposed. The placement of the electromagnetic absorber was investigated to maximise the reduction of cavity resonance. The results show that the optimum position is at the corners of the cavity. A package with a cutoff frequency of approximately 23 GHz was modified to achieve a frequency range up to at least 60 GHz.
Keywords
electromagnetic wave absorption; integrated circuit technology; microwave integrated circuits; packaging; 60 GHz; EHF; MIC; SHF; cavity resonance; cutoff frequency; electromagnetic absorber; resonance-free package;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19930584
Filename
216283
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