• DocumentCode
    901723
  • Title

    Wideband package using an electromagnetic absorber

  • Author

    Iwasaki, Naoki ; Katsura, Kenshiro ; Kukutsu, Naoya

  • Author_Institution
    NTT Interdisciplinary Research Labs., Tokyo, Japan
  • Volume
    29
  • Issue
    10
  • fYear
    1993
  • fDate
    5/13/1993 12:00:00 AM
  • Firstpage
    875
  • Lastpage
    876
  • Abstract
    A novel wideband and resonance-free package is proposed. The placement of the electromagnetic absorber was investigated to maximise the reduction of cavity resonance. The results show that the optimum position is at the corners of the cavity. A package with a cutoff frequency of approximately 23 GHz was modified to achieve a frequency range up to at least 60 GHz.
  • Keywords
    electromagnetic wave absorption; integrated circuit technology; microwave integrated circuits; packaging; 60 GHz; EHF; MIC; SHF; cavity resonance; cutoff frequency; electromagnetic absorber; resonance-free package;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19930584
  • Filename
    216283