• DocumentCode
    901876
  • Title

    X-Ray Wafer Probe for Total Dose Testing

  • Author

    Palkuti, Leslie J. ; LePage, James J.

  • Author_Institution
    Advanced Research and Applications Corporation 1223 East Arques Avenue Sunnyvale, California 94086
  • Volume
    29
  • Issue
    6
  • fYear
    1982
  • Firstpage
    1832
  • Lastpage
    1837
  • Abstract
    An x-ray source has been developed for total-dose irradiation testing of semiconductor electronic devices at the wafer stage of fabrication. This Semiconductor X-ray Test Source, as it is designated, was designed to provide an intense, uniform exposure to the device under test. The dose-rate range of 50 to 2×105 rad(Si) per minute allows test flexibility, high throughput, and facilitates standardization with fixed dose-rate sources. Bias to the die being irradiated is applied by the wafer prober; and a collimator mounted on the probe card permits the irradiation of discrete areas of the wafer or individual die. An electronic shutter system permits manual or automatic operation. A silicon detector provides a direct measurement of the dose-rate delivered to the device under test. Good correlation between doses administered by a cobalt-60 source and the test source has been demonstrated. Routine probe testing sequences can be accomplished automatically through a computer interface. Safety features include an enclosure that is both radiation-safe and light-tight; a vital shutter system; interlocks; and a warning light.
  • Keywords
    Collimators; Detectors; Electronic equipment testing; Fabrication; Manuals; Probes; Semiconductor device testing; Silicon; Standardization; Throughput;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.1982.4336456
  • Filename
    4336456