Modeling and analysis of vias in multilayered integrated circuits

Author

Gu, Qizheng ; Yang, Y. Eric ; Tassoudji, M. Ali

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA

Volume

41

Issue

2

fYear

1993

fDate

2/1/1993 12:00:00 AM

Firstpage

206

Lastpage

214

Abstract

A method for modeling and analyzing vias the multilayered integrated circuits is presented. The model is based on microwave network theory. The whole via structure is divided into cascaded subnetworks, including a vertical via passing through different layers and transitions from the microstrip line and/or striplines to the vertical via. The parameters of each subnetwork are obtained from electromagnetic field analysis. Numerical results in the frequency domain and the time domain are presented. Validation of the model has been carried out by both measurements and finite-difference-time-domain (FDTD) modeling. The results show good agreement with the measurements in the frequency range for which the components of the experimental model are within specification. The time domain simulation results also agree well with the FDTD results

Keywords

electromagnetic field theory; equivalent circuits; finite difference time-domain analysis; integrated circuits; microstrip lines; modelling; packaging; simulation; strip lines; FDTD; cascaded subnetworks; electromagnetic field analysis; finite-difference-time-domain; frequency domain; microstrip line; microwave network theory; modeling; multilayered integrated circuits; striplines; time domain simulation; via structure; vias; Electromagnetic analysis; Electromagnetic fields; Electromagnetic measurements; Finite difference methods; Frequency domain analysis; Integrated circuit modeling; Microstrip; Microwave theory and techniques; Stripline; Time domain analysis;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.216458

Filename

216458