Title :
Modeling and analysis of vias in multilayered integrated circuits
Author :
Gu, Qizheng ; Yang, Y. Eric ; Tassoudji, M. Ali
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
fDate :
2/1/1993 12:00:00 AM
Abstract :
A method for modeling and analyzing vias the multilayered integrated circuits is presented. The model is based on microwave network theory. The whole via structure is divided into cascaded subnetworks, including a vertical via passing through different layers and transitions from the microstrip line and/or striplines to the vertical via. The parameters of each subnetwork are obtained from electromagnetic field analysis. Numerical results in the frequency domain and the time domain are presented. Validation of the model has been carried out by both measurements and finite-difference-time-domain (FDTD) modeling. The results show good agreement with the measurements in the frequency range for which the components of the experimental model are within specification. The time domain simulation results also agree well with the FDTD results
Keywords :
electromagnetic field theory; equivalent circuits; finite difference time-domain analysis; integrated circuits; microstrip lines; modelling; packaging; simulation; strip lines; FDTD; cascaded subnetworks; electromagnetic field analysis; finite-difference-time-domain; frequency domain; microstrip line; microwave network theory; modeling; multilayered integrated circuits; striplines; time domain simulation; via structure; vias; Electromagnetic analysis; Electromagnetic fields; Electromagnetic measurements; Finite difference methods; Frequency domain analysis; Integrated circuit modeling; Microstrip; Microwave theory and techniques; Stripline; Time domain analysis;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
