DocumentCode :
904134
Title :
Relationship Between Surface Electrostatic Potential and Deposition of Airborne Bacteria
Author :
Miksch, Robert R. ; Gefter, Peter ; Gehlke, Scott ; Halpin, Helen Ann ; Meschke, John Scott ; Smith, Brian ; Yost, Michael
Author_Institution :
IEH Labs. & Consulting Inc., Forest Park, WA
Volume :
45
Issue :
3
fYear :
2009
Firstpage :
1068
Lastpage :
1073
Abstract :
Recent work has demonstrated that airborne bacteria can carry high net charges which may influence their deposition onto surfaces. This paper investigated the relationship between surface electric potential relative to ground and the deposition rate of airborne bacteria. Nutrient-agar settle plates were charged to potentials of +/-5, +/- 2.5, and 0 kV and microbial deposition (CFU/cm2middoth) enumerated in an office restroom environment. Results showed that deposition rates were enhanced in proportion to the surface potential to a maximum of approximately twofold. The results were consistent with framework modeling of the relative contributions of electrostatic attraction (ESA), sedimentation, and diffusion deposition rates. It is concluded that ESA can significantly increase deposition rates under selected conditions. This has implications for health-care settings and may provide a basis for application of particle-deposition-reduction engineering controls that have been successfully employed in the semiconductor industry.
Keywords :
aerosols; electric fields; integrated circuit manufacture; microorganisms; surface potential; airborne bacteria; deposition rate; electrostatic attraction; health-care; particle-deposition-reduction; semiconductor industry; surface electrostatic deposition; surface electrostatic potential; Aerosols; Contamination; Electric potential; Electrokinetics; Electronics industry; Electrostatics; Microorganisms; Occupational health; Plastics; Public healthcare; Airborne bacteria; bioaerosols; bipolar ionization; deposition rate; health care; unipolar deposition;
fLanguage :
English
Journal_Title :
Industry Applications, IEEE Transactions on
Publisher :
ieee
ISSN :
0093-9994
Type :
jour
DOI :
10.1109/TIA.2009.2018977
Filename :
4957534
Link To Document :
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