Title :
Multilevel metal capacitance models for CAD design synthesis systems
Author :
Chern, Jue-Hsien ; Huang, Jean ; Arledge, Lawrence ; Li, Ping-Chung ; Yang, Ping
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
An empirical model for multilevel interconnect capacitance is presented. This is the first model that allows designers to compute capacitances of arbitrary complex metal geometries. Such flexibility is achieved by a novel strategy of constructing complex geometries from simple primitive cells. Agreement with accurate simulations and measurements is within 8% over an extensive range of dimensions.<>
Keywords :
capacitance; circuit layout CAD; metallisation; CAD design synthesis systems; arbitrary complex metal geometries; complex geometries construction; empirical model; multilevel metal capacitance models; Analytical models; Capacitance; Computational geometry; Computational modeling; Design automation; Equations; Instruments; Numerical simulation; Process design; Solid modeling;
Journal_Title :
Electron Device Letters, IEEE