Title :
A 340–380 GHz Integrated CB-CPW-to-Waveguide Transition for Sub Millimeter-Wave MMIC Packaging
Author :
Leong, Kevin M K H ; Deal, William R. ; Radisic, Vesna ; Mei, Xiao Bing ; Uyeda, Jansen ; Samoska, Lorene ; Fung, Andy ; Gaier, Todd ; Lai, Richard
Author_Institution :
Northrop Grumman Corp., Redondo Beach, CA
fDate :
6/1/2009 12:00:00 AM
Abstract :
In this letter, a rectangular waveguide to conductor backed-coplanar waveguide electromagnetic transition suitable of operating at sub-millimeter wave frequencies is demonstrated. The dipole based transition is fabricated using InP monolithic microwave integrated circuit technology. The compact transition eliminates wire-bonding problems (return loss and insertion loss) and is suitable for direct integration of sub-millimeter wave monolithic integrated circuits. Measured transition loss of ~1 dB has been achieved in the frequency range of 340 to 380 GHz.
Keywords :
MMIC; coplanar waveguides; integrated circuit packaging; rectangular waveguides; submillimetre wave integrated circuits; waveguide transitions; conductor backed-coplanar waveguide electromagnetic transition; dipole based transition; frequency 340 GHz to 380 GHz; integrated CB-CPW-to-waveguide transition; monolithic microwave integrated circuit technology; rectangular waveguide; submillimeter-wave MMIC packaging; wire-bonding problems; Coplanar waveguide (CPW); monolithic microwave integrated circuit (MMIC); waveguide transition;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2009.2020043
