• DocumentCode
    911593
  • Title

    Enhanced mobility top-gate amorphous silicon thin-film transistor with selectively deposited source/drain contacts

  • Author

    Parsons, G.N.

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
  • Volume
    13
  • Issue
    2
  • fYear
    1992
  • Firstpage
    80
  • Lastpage
    82
  • Abstract
    Amorphous silicon thin-film transistors (TFTs), in a top-gate staggered electrode structure have been prepared using selectively deposited doped silicon contact layers, formed in-situ by plasma-enhanced chemical vapor deposition (PECVD). Selective deposition reduces the number of processing steps and assures the formation of low-resistance contacts. Devices fabricated with two photomasks and one plasma deposition step show saturation and linear mobilities as high as 1.1 and 0.9 cm/sup 2//V-s, respectively, with threshold voltages between 3 and 6 V. On/off ratios are >10/sup 6/, with a subthreshold slope of 0.8 V/decade. The mobilities are at least a factor or 2 higher than previously reported for top-gate structures and are similar to values reported for bottom-gate (inverted staggered) TFTs.<>
  • Keywords
    amorphous semiconductors; carrier mobility; elemental semiconductors; insulated gate field effect transistors; silicon; thin film transistors; 3 to 6 V; PECVD; TFT; amorphous Si; chemical vapor deposition; doped contact layers; enhanced mobility devices; low-resistance contacts; plasma-enhanced CVD; selectively deposited source/drain contacts; thin-film transistors; threshold voltages; top-gate staggered electrode; Amorphous silicon; Electrodes; Fabrication; Hydrogen; Plasma applications; Plasma chemistry; Plasma devices; Plasma displays; Plasma materials processing; Thin film transistors;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.144965
  • Filename
    144965