DocumentCode :
911593
Title :
Enhanced mobility top-gate amorphous silicon thin-film transistor with selectively deposited source/drain contacts
Author :
Parsons, G.N.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Volume :
13
Issue :
2
fYear :
1992
Firstpage :
80
Lastpage :
82
Abstract :
Amorphous silicon thin-film transistors (TFTs), in a top-gate staggered electrode structure have been prepared using selectively deposited doped silicon contact layers, formed in-situ by plasma-enhanced chemical vapor deposition (PECVD). Selective deposition reduces the number of processing steps and assures the formation of low-resistance contacts. Devices fabricated with two photomasks and one plasma deposition step show saturation and linear mobilities as high as 1.1 and 0.9 cm/sup 2//V-s, respectively, with threshold voltages between 3 and 6 V. On/off ratios are >10/sup 6/, with a subthreshold slope of 0.8 V/decade. The mobilities are at least a factor or 2 higher than previously reported for top-gate structures and are similar to values reported for bottom-gate (inverted staggered) TFTs.<>
Keywords :
amorphous semiconductors; carrier mobility; elemental semiconductors; insulated gate field effect transistors; silicon; thin film transistors; 3 to 6 V; PECVD; TFT; amorphous Si; chemical vapor deposition; doped contact layers; enhanced mobility devices; low-resistance contacts; plasma-enhanced CVD; selectively deposited source/drain contacts; thin-film transistors; threshold voltages; top-gate staggered electrode; Amorphous silicon; Electrodes; Fabrication; Hydrogen; Plasma applications; Plasma chemistry; Plasma devices; Plasma displays; Plasma materials processing; Thin film transistors;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.144965
Filename :
144965
Link To Document :
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