Influence of an impedance step in interconnection inductance calculation

Author

Clavel, E. ; Schanen, J.L. ; Roudet, J. ; Maréchal, Y.

Author_Institution

Lab. d´´Electrotech. de Grenoble, CNRS, St. Martin d´´Heres, France

Volume

32

Issue

3

fYear

1996

fDate

5/1/1996 12:00:00 AM

Firstpage

824

Lastpage

827

Abstract

With increasing frequency and power integration in many power electronics applications, interconnection modeling becomes of great importance. The aim of this paper is to present how to take into account an impedance step in an interconnection track (solder pad for instance) using PEEC method (partial element equivalent circuit). The better way to decompose the discontinuity is studied, according to the frequency of interest. Results are compared to measurements, carried out on a printed circuit board (PCB) loop and to analytical resolution at low frequency

Keywords

electric impedance; equivalent circuits; inductance; power electronics; printed circuit design; PCB loop; discontinuity decomposition; impedance step; interconnection inductance calculation; interconnection modeling; interconnection track; partial element equivalent circuit method; power electronics applications; power integration; printed circuit board loop; solder pad; Conducting materials; Conductivity; Copper; Current distribution; Electric resistance; Equivalent circuits; Frequency; Frequency measurement; Impedance; Inductance; Integrated circuit interconnections; Power electronics; Printed circuits; Skin effect;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/20.497368

Filename

497368