DocumentCode :
912554
Title :
Chip Substrate Resistance Modeling Technique for Integrated Circuit Design
Author :
Johnson, Thomas A. ; Knepper, Ronald W. ; Marcello, Victor ; Wang, Wen
Author_Institution :
IBM General Technology Division, East Fishkill Facility, Hopewell Junction, NY, USA
Volume :
3
Issue :
2
fYear :
1984
fDate :
4/1/1984 12:00:00 AM
Firstpage :
126
Lastpage :
134
Abstract :
With the advent of VLSI and the use of statistical simulation techniques to perform integrated circuit design, modeling of chip substrate resistance is becoming increasingly important to successful chip design. This paper will present a substrate resistance modeling technique which may be applied to the design of both FET and bipolar chips. After briefly presenting the theory behind the technique, we will describe its use in developing a substrate resistance model required for studying a disturb problem encountered with a high-speed array chip. The steps involved in building and simplifying the substrate model will be described. The effect on circuit simulations and noise sensitivity will then be shown.
Keywords :
Automatic testing; Circuit testing; FETs; Integrated circuit modeling; Integrated circuit synthesis; Radar antennas; Space technology; System testing; Very large scale integration; Voltage;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.1984.1270066
Filename :
1270066
Link To Document :
بازگشت