Title :
CMOS mobility degradation coefficients at low temperatures
Author :
Campbell, S.A. ; Andersen, P.
Author_Institution :
University of Minnesota, Department of Electrical Engineering, 139 Electrical Eng., Minneapolis, USA
fDate :
2/1/1988 12:00:00 AM
Abstract :
An AC measurement technique is applied to NMOS and PMOS devices fabricated using a 1.25 ¿m CMOS process. The parasitic resistance and mobility degradation coefficients have been extracted for temperatures between 25 K and 300 K. The NMOS parasitic resistance stays flat with temperature while the PMOS resistance rises sharply below 200 K, probably due to the light source/drain diffusion doping. The mobility reduction parameter ¿, shows a clear 1/T behaviour between 100 K and room temperature, with ¿ approaching unity for the PMOS devices. This may have serious implications for the performance of highly scaled devices which operate at high transverse electrical fields.
Keywords :
CMOS integrated circuits; carrier mobility; 1.25 micron; 25 to 300 K; AC measurement technique; CMOS process; NMOS parasitic resistance; PMOS devices; high transverse electrical fields; highly scaled devices; light source/drain diffusion doping; low temperatures; mobility degradation coefficients; mobility reduction parameter; monolithic IC;
Journal_Title :
Solid-State and Electron Devices, IEE Proceedings I
DOI :
10.1049/ip-i-1.1988.0004