Title :
Simulations of thermally induced photoacoustic wave propagation using a pseudospectral time-domain method
Author :
Sheu, Yae-Lin ; Li, Pai-Chi
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei
fDate :
5/1/2009 12:00:00 AM
Abstract :
Most physical models used to evaluate thermally induced photoacoustic waves in biomedical applications are approximations based on assumptions necessary to obtain analytical results, such as thermal and stress confinements. In contrast, using numerical methods to solve the general photoacoustic wave equations gives detailed information on the wave phenomenon without requiring as many assumptions to be made. The photoacoustic wave generated by thermal expansion is characterized by the heat conduction theorem and the state, continuity, and Navier-Stokes equations. This study developed a numerical solution in axis-symmetric cylindrical coordinates using a pseudospectral time-domain scheme. The method is efficient for large-scale simulations since it requires only 2 grid points per minimum wavelength, in contrast to conventional methods such as the finite-difference time-domain method requiring at least 10~20 grid points. The numerical techniques included Berenger´s perfectly matched layers for free wave simulations, and a linear-perturbation analytical solution was used to validate the simulation results. The numerical results obtained using 4 grid points per minimum wavelength in the simulation domain agreed with the theoretical estimates to within an absolute difference error of 3.87 times 10-2 for a detection distance of 3.1 mm.
Keywords :
acoustic wave propagation; finite difference time-domain analysis; heat conduction; photoacoustic effect; thermal expansion; Navier-Stokes equations; finite-difference time-domain method; heat conduction theorem; pseudospectral time-domain method; thermal expansion; thermally induced photoacoustic wave propagation; Analytical models; Character generation; Finite difference methods; Large-scale systems; Navier-Stokes equations; Partial differential equations; Thermal conductivity; Thermal expansion; Thermal stresses; Time domain analysis;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
DOI :
10.1109/TUFFC.2009.1144