DocumentCode :
915486
Title :
SPIDER -- A CAD System for Modeling VLSI Metallization Patterns
Author :
Hall, Joseph E. ; Hocevar, Dale E. ; Yang, Ping ; Mcgraw, Michael J.
Author_Institution :
Semiconductor Process and Design Center, Texas Instruments, Inc., Dallas, TX, USA
Volume :
6
Issue :
6
fYear :
1987
fDate :
11/1/1987 12:00:00 AM
Firstpage :
1023
Lastpage :
1031
Abstract :
A system of CAD programs, called SPIDER, for ensuring adequate current-carrying capacity in VLSI circuits has been developed. The approach is hierarchical, and it automates and simplifies many of the tasks previously performed by the circuit designer. The system converts transient current waveforms into dc electromigration equivalent values, and includes an algorithm for determining the line width adjustments necessary for meeting specified median-time-to-failure (MTF) requirements. SPIDER also computes voltage drops with respect to a reference node and calls upon an optimization algorithm for correcting violations of a voltage drop specification.
Keywords :
Circuit analysis; Conductors; Current density; Design automation; Electromigration; Finite element methods; Instruments; Metallization; Very large scale integration; Voltage;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.1987.1270343
Filename :
1270343
Link To Document :
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