DocumentCode
915743
Title
A Highly Reliable Lateral MEMS Switch Utilizing Undoped Polysilicon as Isolation Material
Author
Shi, Wendian ; Tien, Norman C. ; Li, Zhihong
Author_Institution
Peking Univ., Beijing
Volume
16
Issue
5
fYear
2007
Firstpage
1173
Lastpage
1184
Abstract
The lateral actuated switch requires an isolation structure to provide mechanical coupling and electrical isolation between the actuator and the contacts. This isolation structure usually imposes extra difficulty on the fabrication process. In previous reports, we demonstrated a thermal actuated lateral switch, where the nitride isolation structure was a weak point, leading to reliability problems. In this paper, we developed a modified switch utilizing undoped polysilicon as the isolation material. The undoped-polysilicon isolation structure requires only one extra step of sheltered implantation, and it provides robust mechanical connection. A 20-mum-long undoped-polysilicon isolation structure has a current leakage of less than 2 nA under a 15-V operation voltage. The proposed switch works under a 12-V driving voltage with 60-mW input power. The time response is measured to be 130 mus, and a maximum operation frequency of 4.5 kHz is reached. An ON-state insertion loss of -0.41 dB at 20 GHz and an OFF-state isolation of -20 dB at 20 GHz have been achieved on the normal low-resistivity silicon substrate. The undoped-polysilicon isolation method can be used in other surface-micromachined lateral switches as well.
Keywords
electrical resistivity; isolation technology; microswitches; silicon; Si - Element; actuator; current leakage; electrical isolation; frequency 20 GHz; frequency 4.5 kHz; isolation material; isolation structure; lateral actuated switch; loss -0.41 dB; loss -20 dB; low-resistivity silicon substrate; mechanical coupling; microrelay; power 60 mW; radio frequency switch; reliable lateral MEMS switch; size 20 micron; time 130 mus; undoped polysilicon; voltage 12 V; voltage 15 V; Actuators; Contacts; Couplings; Fabrication; Materials reliability; Microswitches; Robustness; Switches; Time factors; Voltage; Electrical isolation; isolation structure; mechanical coupling; microrelay; radio frequency (RF) switch;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2007.901121
Filename
4337807
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