Title :
Design for reliability: the major challenge for VLSI
Author :
Yang, Ping ; Chern, Jue-Hsien
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
fDate :
5/1/1993 12:00:00 AM
Abstract :
Selected integrated circuit (IC) reliability issues are discussed within the context of the design-in reliability concept. The electrical reliability issues discussed are latchup, electrostatic discharge, hot carrier effects, thin dielectric breakdown, and electromigration. Examples of the environmental reliability issues discussed are α-particle induced soft errors, thermal stress, mechanical stress, and corrosion
Keywords :
VLSI; circuit reliability; corrosion; electric breakdown of solids; electromigration; electrostatic discharge; hot carriers; integrated circuit technology; thermal stresses; α-particle induced soft errors; VLSI; corrosion; design for reliability; electrical reliability; electromigration; electrostatic discharge; environmental reliability; hot carrier effects; integrated circuit; latchup; mechanical stress; thermal stress; thin dielectric breakdown; Circuit synthesis; Computer aided manufacturing; Electrostatic discharge; Hot carrier effects; Predictive models; Product design; Qualifications; Semiconductor process modeling; Time to market; Very large scale integration;
Journal_Title :
Proceedings of the IEEE
