Title :
Shielded passive devices for silicon-based monolithic microwave and millimeter-wave integrated circuits
Author :
Cheung, Tak Shun Dickson ; Long, John R.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Toronto, Ont., Canada
fDate :
5/1/2006 12:00:00 AM
Abstract :
This paper introduces floating shields for on-chip transmission lines, inductors, and transformers implemented in production silicon CMOS or BiCMOS technologies. The shield minimizes losses without requiring an explicit on-chip ground connection. Experimental measurements demonstrate Q-factor ranging from 25 to 35 between 15 and 40 GHz for shielded coplanar waveguide fabricated on 10 Ω·cm silicon. This is more than a factor of 2 improvement over conventional on-chip transmission lines (e.g., microstrip, CPW). A floating-shielded, differentially driven 7.4-nH inductor demonstrates a peak Q of 32, which is 35% higher than an unshielded example. Similar results are realizable for on-chip transformers. Floating-shielded bond-pads with 15% less parasitic capacitance and over 60% higher shunt equivalent resistance compared to conventional shielded bondpads are also described. Implementation of floating shields is compatible with current and projected design constraints for production deep-submicron silicon technologies without process modifications. Application examples of floating-shielded passives implemented in a 0.18-μm SiGe-BiCMOS are presented, including a 21-26-GHz power amplifier with 23-dBm output at 20% PAE (at 22 GHz), and a 17-GHz WLAN image-reject receiver MMIC which dissipates less than 65 mW from a 2-V supply.
Keywords :
BiCMOS integrated circuits; Ge-Si alloys; coplanar waveguides; inductors; microwave integrated circuits; millimetre wave integrated circuits; transformers; 0.18 micron; 10 ohm; 15 to 40 GHz; 17 GHz; 2 V; 21 to 26 GHz; BiCMOS; SiGe; WLAN image-reject receiver MMIC; floating shields; floating-shielded bond-pads; floating-shielded inductor; floating-shielded passives; millimeter-wave integrated circuits; monolithic microwave integrated circuits; on-chip transmission lines; power amplifiers; shielded coplanar waveguide; shielded passive devices; CMOS technology; Coplanar transmission lines; Coplanar waveguides; Inductors; Microwave devices; Millimeter wave integrated circuits; Power transmission lines; Production; Silicon; Transformers; Bondpads; MMICs; coplanar transmission lines; floating shield; inductors; millimeter-wave integrated circuits; on-chip interconnects; patterned ground shield; silicon; slow-wave transmission lines; substrate loss; transformers;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2006.872737