DocumentCode :
916339
Title :
Quantitative heat transfer measurements in hypersonic wind tunnels by means of infrared thermography
Author :
Simeonides, G. ; Vermeulen, J.-P. ; Boerrigter, H.L. ; Wendt, J.E.
Author_Institution :
von Karman Inst. for Fluid Dynamics, Rhode Saint Genese, Belgium
Volume :
29
Issue :
3
fYear :
1993
fDate :
7/1/1993 12:00:00 AM
Firstpage :
878
Lastpage :
893
Abstract :
A description of infrared (IR) thermography, as it is employed in a hypersonic blowdown wind tunnel for the acquisition of high quality two-dimensional heat transfer data over aerodynamic surfaces, is given. It is shown that the availability of an IR scanning radiometer and a standard digital image processing (DIP) system in the laboratory provides the means for highly efficient (in terms of time and cost) heat transfer measurement, with accuracy levels comparable to those achieved by classical discrete point gauges, such as thin-film surface resistance thermometers and thermocouples. The advantages of IR thermal mapping over the classical techniques, not only in measuring heat transfer distributions over complex three-dimensional configurations and in locating and quantifying highly localized hot spots, but also in interpreting puzzling results observed on simple configurations, are illustrated using a series of examples. A discussion of the limitations of the technique indicates that most of such limitations are common to classical `zero-dimensional´ instrumentation as well
Keywords :
hypersonic flow; image processing equipment; infrared detectors; infrared imaging; radiometers; thermal variables measurement; wind tunnels; IR scanning radiometer; IR thermal mapping; aerodynamic surfaces; calibration; complex three-dimensional configurations; cost; digital image processing; heat transfer measurement; hypersonic blowdown wind tunnel; infrared thermography; localized hot spots; quantitative measurement; two-dimensional heat transfer; zero dimensional instrumentation; Aerodynamics; Digital images; Electrical resistance measurement; Electronics packaging; Heat transfer; Infrared heating; Laboratories; Measurement standards; Radiometry; Surface resistance;
fLanguage :
English
Journal_Title :
Aerospace and Electronic Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9251
Type :
jour
DOI :
10.1109/7.220961
Filename :
220961
Link To Document :
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