Title :
Compact high-impedance surfaces integrated with rhombic interdigital structure
Author :
Lin, B.-Q. ; Cao, X.Y. ; Yang, Y.M. ; Wen, X.
Author_Institution :
Eng. Univ. of Air Force, Xi´´an
Abstract :
A novel compact electromagnetic bandgap structure is presented for size reduction. The proposed structure can be considered as an ameliorated high-impedance surface integrated with a rhombic interdigital structure. This structure significantly enlarges the fringe capacitance between neighbouring elements to compress the overall size of the structure. The measured results show that an even more compact structure can be obtained.
Keywords :
photonic band gap; electromagnetic bandgap structure; fringe capacitance; high-impedance surface; rhombic interdigital structure;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20071661
