DocumentCode :
917475
Title :
Etching of {\\rm MgB}_{2} Thin Films for Transition Edge Superconducting Bolometer Fabrication
Author :
Aslam, Shahid ; Stevenson, Thomas R. ; Hsieh, Wen-Ting ; Travers, Douglas E. ; Jones, Hollis H. ; Lakew, Brook
Author_Institution :
MEI Technol. Inc., Houston, TX, USA
Volume :
19
Issue :
3
fYear :
2009
fDate :
6/1/2009 12:00:00 AM
Firstpage :
257
Lastpage :
260
Abstract :
Membrane-structured superconducting MgB2 thin films are potential candidates for the development of moderately cooled bolometers sensitive to far infra-red radiation. On the path to developing such devices, we present a comparison of three etching techniques for MgB2 thin films namely, chlorine plasma etch, aqueous hydrochloric acid etch and an aqueous nitric acid etch. Out of the three etch techniques, the aqueous 50% nitric acid solution etch, using standard photolithography, proved to have a high MgB2 etch rate (> 51 nm/s), with better sidewall delineation and selectivity to the underlying SiN-film-coated Si substrate, moreover the etched film structure showed good superconductivity transition characteristics, namely, a superconducting critical transition at 38.57 plusmn 0.6 K, a transition width of 0.09 K and a RRR of 2.22.
Keywords :
bolometers; etching; magnesium compounds; photolithography; superconducting devices; superconducting materials; superconducting photodetectors; superconducting thin films; superconducting transition temperature; MgB2; Si; aqueous hydrochloric acid etch; aqueous nitric acid etch; chlorine plasma etch; etched film structure; etching techniques; far infrared radiation; membrane-structured superconducting thin films; silicon substrate; standard photolithography; superconducting critical transition; transition edge superconducting bolometer fabrication; ${rm HNO}_{3}$ -etch; ${rm MgB}_{2}$; Bolometer; Cl-plasma based etch; HCl-etch; etching; superconducting transition; thin film;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2009.2017855
Filename :
4982584
Link To Document :
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