Assembly of Micro-3-D Components on SOI Wafers Using Novel SU-8 Locking Mechanisms and Vertical One-Push Operation

Author

Chiu, Yi ; Wu, Chang-Shiou ; Huang, Wei-Zhi ; Wu, Jhong-Wei

Author_Institution

Dept. of Electr. & Control Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan

Volume

15

Issue

5

fYear

2009

Firstpage

1338

Lastpage

1343

Abstract

A novel out-of-plane assembly technique of 3-D microstructures is proposed and demonstrated by using simple vertical one-push operations. This one-push method has large probe positioning tolerance in both vertical and lateral directions to reduce the overall complexity of the assembly process. Micromirrors and corner cube reflectors are fabricated on silicon-on-insulator wafers using SU-8 photoresist as a second structure layer in a low-temperature process. Batch assembly of multiple mirrors assembled simultaneously is demonstrated.

Keywords

cryogenic electronics; microassembling; micromirrors; photoresists; silicon-on-insulator; 3D microstructures; SOI wafers; SU-8 locking mechanisms; SU-8 photoresist; corner cube reflectors; low-temperature process; micro3D components; micromirrors; multiple mirrors; out-of-plane assembly; silicon on insulator; vertical one-push operation; Assembly; hinge; microelectromechanical system (MEMS); one push; out of plane;

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/JSTQE.2009.2018478

Filename

4982735