DocumentCode :
921425
Title :
Single-transistor-latch-induced degradation of front- and back-channel thin-film SOI transistors
Author :
Zhang, Binglong ; Yoshino, Akira ; Ma, Tso-Ping
Author_Institution :
Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
Volume :
13
Issue :
5
fYear :
1992
fDate :
5/1/1992 12:00:00 AM
Firstpage :
282
Lastpage :
284
Abstract :
The front- and back-channel transistor characteristics in thin-film silicon-on-insulator (SOI) MOSFETs have been studied before and after front-channel hot-carrier stress resulting from single-transistor latch. This stress causes the following significant changes: (a) a reduction of the front-channel current for a given gate voltage, (b) an increase in front-channel drain-source breakdown voltage when measured in the reverse mode, and (c) a decrease in the back-channel transconductance. These changes can be attributed to the hot-carrier induced interface traps on both front and back interfaces near the drain junction.<>
Keywords :
hot carriers; insulated gate field effect transistors; interface electron states; semiconductor device testing; semiconductor-insulator boundaries; thin film transistors; Si-SiO/sub 2/; back-channel transconductance; back-channel transistor; front-channel current; front-channel drain-source breakdown voltage; front-channel hot-carrier stress; hot-carrier induced interface traps; single transistor latch induced degradation; subthreshold characteristics; thin film SOI MOSFET; Breakdown voltage; Current measurement; Degradation; Hot carriers; MOSFETs; Semiconductor thin films; Silicon on insulator technology; Stress; Thin film transistors; Voltage measurement;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.145054
Filename :
145054
Link To Document :
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