Title :
Analysis of thin-film-dielectric decoupling of interdigital transducers
Author_Institution :
Texas Instruments Inc., Dallas, USA
Abstract :
A perturbation analysis is presented for the reduction in the coupling coefficient ¿V/V of an interdigital transducer that is spaced away from the surface of a piezoelectric substrate by a thin isotropic nonpiezoelectric dielectric film. The analysis shows that the static capacitance and coupling ¿V/V are reduced rapidly by the addition of thin dielectric films, while the series radiation resistance is relatively insensitive to film thickness for films less than approximately 0.03 wavelengths.
Keywords :
acoustic surface wave devices; insulating thin films; ultrasonic transducers; acoustic surface wave devices; coupling coefficient; insulating thin films; interdigital transducers; perturbation analysis; piezoelectric substrate; static capacitance; ultrasonic transducers;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19730218