DocumentCode
922883
Title
Analysis of thin-film-dielectric decoupling of interdigital transducers
Author
Wagers, R.S.
Author_Institution
Texas Instruments Inc., Dallas, USA
Volume
9
Issue
14
fYear
1973
Firstpage
302
Lastpage
304
Abstract
A perturbation analysis is presented for the reduction in the coupling coefficient ¿V/V of an interdigital transducer that is spaced away from the surface of a piezoelectric substrate by a thin isotropic nonpiezoelectric dielectric film. The analysis shows that the static capacitance and coupling ¿V/V are reduced rapidly by the addition of thin dielectric films, while the series radiation resistance is relatively insensitive to film thickness for films less than approximately 0.03 wavelengths.
Keywords
acoustic surface wave devices; insulating thin films; ultrasonic transducers; acoustic surface wave devices; coupling coefficient; insulating thin films; interdigital transducers; perturbation analysis; piezoelectric substrate; static capacitance; ultrasonic transducers;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19730218
Filename
4236164
Link To Document