• DocumentCode
    925423
  • Title

    Fully micromachined finite-ground coplanar line-to-waveguide transitions for W-band applications

  • Author

    Lee, Yongshik ; Becker, James P. ; East, Jack R. ; Katehi, Linda P B

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI, USA
  • Volume
    52
  • Issue
    3
  • fYear
    2004
  • fDate
    3/1/2004 12:00:00 AM
  • Firstpage
    1001
  • Lastpage
    1007
  • Abstract
    A fully micromachined finite-ground coplanar (FGC) line-to-waveguide transition for W-band applications has been designed, fabricated, and tested. The transition utilizes a printed E-plane probe, inserted into the broad sidewall of a micromachined waveguide. This type of transition plays an important role in many applications where coupling between the popular FGC line and a waveguide is required. Excellent performance across the entire W-band of such a transition is presented in this paper. The investigated waveguide, micromachined in silicon using the deep reactive ion etching technique, demonstrates its potential as an alternative to costly conventional waveguides at high frequencies. A similar transition with a micromachined waveguide formed via bulk micromachining using a wet etchant is also demonstrated. The free-standing probe utilized in this second transition proves the potential of such transitions to be applicable well into the submillimeter and terahertz range.
  • Keywords
    micromachining; rectangular waveguides; sputter etching; waveguide transitions; W-band applications; bulk micromachining; deep reactive ion etching; finite-ground coplanar line-to-waveguide transition; freestanding probe; fully micromachined transition; printed E-plane probe; similar transition; wet etchant; Coplanar waveguides; Etching; Frequency; Laboratories; Micromachining; Planar transmission lines; Planar waveguides; Rectangular waveguides; Solid state circuits; Waveguide transitions;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2004.823580
  • Filename
    1273743