Title :
Direct liquid cooling of room-temperature operated quantum cascade lasers
Author :
Chen, J.-Z. ; Liu, Z. ; Rumala, Y.S. ; Sivco, D.L. ; Gmachl, C.F.
Author_Institution :
Dept. of Electr. Eng., Princeton Univ., Murray Hill, NJ, USA
fDate :
4/27/2006 12:00:00 AM
Abstract :
A compact packaging module for direct liquid cooling of room-temperature quantum cascade lasers is implemented. The light was coupled out of the hermetically sealed package through a mid-infrared fibre epoxy-bonded to the laser. The threshold current reduces by ∼10%, compared to convectional substrate-side cooled lasers when using low boiling temperature (boiling point (b.p.)=34°C) 3M HFE-7000 coolant. No reduction was observed with high boiling point 3M FC-77 (b.p.=97°C) coolant.
Keywords :
cooling; hermetic seals; polymers; quantum cascade lasers; semiconductor device packaging; compact packaging module; direct liquid cooling; laser cooling; mid-infrared fibre epoxy bonding; room-temperature quantum cascade lasers; substrate-side cooled lasers; threshold current;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20064277
