Title :
LSCM: a non-destructive diagnostic tool for examining the microstructure of polymer dielectric films
Author :
Suthar, J.L. ; Laghari, J.R. ; Cheng, P.C.
Author_Institution :
Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
Abstract :
Laser scanning confocal microscopy (LSCM) was used to examine the microstructure of polymer dielectric films for voids and imperfections. Sample films examined included polypropylene (PP), polyimide (PI), teflon perfluoroalkoxy (PFA), poly-p-xylene (PPX), and polyvinylidene fluoride (PVDF) under a variety of conditions. LSCM is a powerful tool for the nondestructive evaluation of dielectric films because it can take two-dimensional, confocal image slices of a structure with resolution down to a few microns without any kind of physical damage to the sample. Its basic concept, capabilities, and usefulness in nondestructive dielectric characterization are demonstrated.<>
Keywords :
dielectric thin films; insulation testing; nondestructive testing; optical microscopy; organic insulating materials; polymer films; polymer structure; voids (solid); imperfections; laser scanning confocal microscopy; microstructure; nondestructive diagnostic tool; poly-p-xylene; polyimide; polymer dielectric films; polypropylene; polyvinylidene fluoride; teflon perfluoroalkoxy; voids; Capacitors; Dielectric films; Light scattering; Microscopy; Microstructure; Optical films; Optical scattering; Polymer films; Signal detection; Voltage;
Journal_Title :
Electrical Insulation Magazine, IEEE
