DocumentCode :
925732
Title :
Trends in diffusion-length measurements in the original and dielectrically isolated-tub π-silicon as a function of processing
Author :
Burk, Dorothea E. ; Chung, B.C.
Author_Institution :
Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
Volume :
36
Issue :
4
fYear :
1989
fDate :
4/1/1989 12:00:00 AM
Firstpage :
750
Lastpage :
760
Abstract :
An EBIC (electron-beam-induced current) analysis of diffusion length and, hence, lifetime as a function of processing history of dielectrically isolated (DI) tubs and the original π-silicon was performed with a two-dimensional computer simulation. The simulation accounts for a pear-shaped excitation volume for the surface recombination at two sidewalls and the top and bottom surfaces and for excess electron diffusion to a planar junction with a planar back contact. The different processing histories include those which have undergone minimal high-temperature heat treatment (prior to and after DI-tub formation), a phosphorus getter, and a denuded-zone treatment. It is found that the DI-tub formation process results in a slight improvement in the diffusion length, but that the denuded-zero treatment results in a significant (ten times the diffusion length in untreated material) improvement in both the original and DI-tub π-silicon
Keywords :
EBIC; carrier lifetime; electron-hole recombination; elemental semiconductors; heat treatment; silicon; EBIC; Si; denuded-zone treatment; dielectrically isolated-tub; diffusion-length measurements; excess electron diffusion; lifetime; minimal high-temperature heat treatment; pear-shaped excitation volume; planar back contact; planar junction; semiconductor; surface recombination; two-dimensional computer simulation; Computational modeling; Computer simulation; Dielectric measurements; Electrons; Gettering; Heat treatment; History; Performance analysis; Spontaneous emission; Surface treatment;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.22481
Filename :
22481
Link To Document :
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