DocumentCode :
926248
Title :
The Einstein relation
Author :
Landsberg, P.T.
Volume :
61
Issue :
4
fYear :
1973
fDate :
4/1/1973 12:00:00 AM
Firstpage :
476
Lastpage :
476
Keywords :
Aluminum alloys; Copper; Degradation; Electromigration; Inorganic materials; Integrated circuit metallization; Semiconductor films; Silicon alloys; Silicon devices; Temperature;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/PROC.1973.9070
Filename :
1451000
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=926248
