• DocumentCode
    927047
  • Title

    A problem reduction approach for scheduling semiconductor wafer fabrication facilities

  • Author

    Upasani, Abhijit A. ; Uzsoy, Reha ; Sourirajan, Karthik

  • Author_Institution
    Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
  • Volume
    19
  • Issue
    2
  • fYear
    2006
  • fDate
    5/1/2006 12:00:00 AM
  • Firstpage
    216
  • Lastpage
    225
  • Abstract
    Most scheduling procedures used in industry are based on the dispatching paradigm, where decisions are made based on the jobs available at the time the machine becomes free. While optimization-based scheduling procedures have repeatedly been shown to yield significantly better schedules under ideal circumstances, their practical implementation is hampered by high computational requirements. We present a problem reduction procedure that allows a workcenter-based global scheduling heuristic to be implemented in very low CPU times. The procedure partitions the workcenters in a fab into heavily loaded and lightly loaded classes and solves the global scheduling problem only for the heavily loaded workcenters. The proposed technique is tested on instances drawn from an International SEMATECH wafer fab model. The proposed problem reduction approach yields superior results with modest computational effort, enabling the practical use of the decomposition heuristic.
  • Keywords
    electronics industry; production facilities; scheduling; semiconductor technology; International SEMATECH; global scheduling; heuristic decomposition; scheduling procedures; semiconductor wafer fabrication facilities; workcenter-based scheduling; Costs; Dispatching; Fabrication; Job shop scheduling; Processor scheduling; Production; Semiconductor device manufacture; Supply chains; Testing; Textile industry; Empirical testing; heuristic decomposition; scheduling;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2006.873510
  • Filename
    1628984