DocumentCode :
927107
Title :
Low-defect-density and high-reliability FETMOS EEPROM´s fabricated using furnace N/sub 2/O oxynitridation
Author :
Kim, Yeong-Seuk ; Okada, Yoshio ; Chang, Ko-Min ; Tobin, Philip J. ; Morton, Bruce ; Choe, Henry ; Bowers, Mickey ; Kuo, Clinton ; Chrudimsky, David ; Ajuria, Sergio A. ; Yeargain, John R.
Author_Institution :
Motorola Inc., Austin, TX, USA
Volume :
14
Issue :
7
fYear :
1993
fDate :
7/1/1993 12:00:00 AM
Firstpage :
342
Lastpage :
344
Abstract :
The superior characteristics of floating-gate electron tunneling MOS (FETMOS) EEPROMs fabricated using a furnace N/sub 2/O oxynitridation process are described. These devices exhibited about eight times better endurance and good data retention characteristics while maintaining defect density comparable to that of the control thermal oxide devices. These devices also showed very good thickness uniformity across the wafer and wafer-to-wafer.<>
Keywords :
CMOS integrated circuits; EPROM; annealing; integrated memory circuits; nitridation; oxidation; 16 kbit; CMOS process; control thermal oxide devices; data retention characteristics; defect density; floating gate electron tunnelling FETMOS EEPROM; furnace N/sub 2/O oxynitridation; EPROM; Electrons; Furnaces; Tunneling;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.225567
Filename :
225567
Link To Document :
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