Title :
Bonding and interconnections for c.c.d.s
Author_Institution :
University College of North Wales, School of Electronic Engineering Science, Bangor, UK
Abstract :
A simple fabrication method to obtain reliable wire bonding to c.c.d.-type circuits is described.
Keywords :
charge-coupled devices; integrated circuit production; CCD; fabrication method; interconnections; wire bonding;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19750123
