DocumentCode :
928522
Title :
Effect of rapid thermal reoxidation on the electrical properties of rapid thermally nitrided thin-gate oxides
Author :
Joshi, Aniruddha B. ; Lo, G.O. ; Shih, D.K. ; Kwong, Dim-Lee
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Volume :
39
Issue :
4
fYear :
1992
fDate :
4/1/1992 12:00:00 AM
Firstpage :
883
Lastpage :
892
Abstract :
The authors report a systematic study of the impact of post-nitridation rapid thermal anneals in oxygen and nitrogen on the electrical properties of MOS devices with thin gate oxides. A comparative study of the two annealing ambients has led to the formulation of qualitative models to describe the charge trapping properties of the respective gate dielectrics. Roles of the post-nitridation anneals in altering the radiation and hot-electron sensitivity of the MOS devices are investigated and explained on the basis of structural changes in the gate oxides during nitridation and subsequent annealing. The performance and reliability of MOSFETs with reoxidized nitrided gate oxides are investigated. Overall, the results indicate that reoxidized nitrided oxides show improved charge trapping properties, better resistance to radiation and hot-carrier stress, and improved high-field electron mobility in MOSFETs
Keywords :
X-ray effects; carrier mobility; electron traps; hot carriers; incoherent light annealing; insulated gate field effect transistors; interface electron states; metal-insulator-semiconductor devices; nitridation; oxidation; reliability; MOS devices; MOSFETs; RTN; RTO; Si-SiO2; Si-SiOxNy; annealing ambients; charge trapping properties; electrical properties; gate dielectrics; high-field electron mobility; hot-electron sensitivity; models; nitridation; polysilicon gate MOS capacitors; post-nitridation rapid thermal anneals; radiation sensitivity; rapid thermal reoxidation; reliability; structural changes; thin-gate oxides; Dielectric substrates; Electron mobility; Electron traps; Hot carriers; Impurities; Ionizing radiation; MOS devices; Nitrogen; Rapid thermal annealing; Stress;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.127479
Filename :
127479
Link To Document :
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