DocumentCode
928814
Title
Inductive fault analysis of surface-micromachined MEMS
Author
Jiang, Tao ; Blanton, R.D.
Author_Institution
Electr. & Comput. Eng. Dept., Carnegie Mellon Univ., Pittsburgh, PA
Volume
25
Issue
6
fYear
2006
fDate
6/1/2006 12:00:00 AM
Firstpage
1104
Lastpage
1116
Abstract
The defects and the corresponding behavior caused by particle contaminants introduced into the fabrication of a combdrive surface-micromachined microresonator are investigated. The microresonator is chosen as a research vehicle since it possesses all the primitive elements used in many types of capacitive-based microelectromechanical systems (MEMS). Fabrication process simulation is used to predict all the possible defective structures caused by contaminants. The resulting defects are then classified based on their geometrical properties. Mechanical and electrical simulations are also used to determine the impact of defect classes on key mechanical and electrical characteristics of the microresonator. This analysis reveals that particles can cause various mechanical defects that include anchors, broken beams, and bridged comb fingers, all of which can have a significant impact on mechanical behavior. On the other hand, there are mechanical defects (e.g., a broken comb finger) that virtually have no effect on mechanical properties but can lead to catastrophic changes in electrical capability
Keywords
fault diagnosis; micromechanical resonators; anchors; bridged comb fingers; broken beams; broken comb finger; capacitive-based microelectromechanical systems; combdrive microresonator; defects; electrical characteristics; fault models; inductive fault analysis; mechanical characteristics; particle contaminants; surface-micromachined MEMS; Electric variables; Fabrication; Fingers; Microcavities; Microelectromechanical systems; Micromechanical devices; Particle beams; Predictive models; Surface contamination; Vehicles; Defects; fault models; microelectromechanical systems (MEMS); test;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2005.855926
Filename
1629143
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