• DocumentCode
    928988
  • Title

    Application of FDTD method to analysis of electromagnetic radiation from VLSI heatsink configurations

  • Author

    Li, Kevin ; Lee, Check F. ; Poh, Soon Y. ; Shin, Robert T. ; Kong, Jin A.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
  • Volume
    35
  • Issue
    2
  • fYear
    1993
  • fDate
    5/1/1993 12:00:00 AM
  • Firstpage
    204
  • Lastpage
    214
  • Abstract
    The electromagnetic radiation from a VLSI chip package and heatsink structure is analyzed by means of the finite-difference-time-domain (FDTD) technique. The dimensions of a typical configuration call for a multizone gridding scheme in the FDTD algorithm to accommodate fine grid cells in the vicinity of the heatsink and package cavity and sparse gridding in the remainder of the computational domain. The issues pertaining to the effects of the heatsink on the overall radiative capacity of the configuration are addressed. Analyses are facilitated by using simplified heatsink models and by using dipole elements as sources of electromagnetic energy to model the VLSI chip. The potential for enhancement of spurious emissions by the heatsink structure is illustrated. For heatsinks of typical dimensions, resonance is possible within the low gigahertz frequency range. The exploitation of the heatsink as an emissions shield by appropriate implementation schemes is discussed and evaluated.
  • Keywords
    VLSI; electromagnetic compatibility; finite difference time-domain analysis; heat sinks; integrated circuit technology; packaging; EM compatibility; EMC; FDTD method; IC; UHF; VLSI chip package; VLSI heatsink configurations; dipole elements; electromagnetic radiation; fine grid cells; finite-difference-time-domain; multizone gridding scheme; package cavity; radiative capacity; resonance; sparse gridding; spurious emissions; Electromagnetic analysis; Electromagnetic heating; Electromagnetic modeling; Electromagnetic radiation; Electromagnetic shielding; Finite difference methods; Grid computing; Packaging; Time domain analysis; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/15.229420
  • Filename
    229420