DocumentCode :
929031
Title :
Finite-element method applied to EMC problems (PCB environment)
Author :
Laroussi, R. ; Costache, G.I.
Author_Institution :
Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
Volume :
35
Issue :
2
fYear :
1993
fDate :
5/1/1993 12:00:00 AM
Firstpage :
178
Lastpage :
184
Abstract :
In a printed circuit board environment, the solution domain is highly inhomogeneous, and analytic expressions for design parameters are very difficult to obtain, even for the simplest configuration. The finite element method (FEM) offers an attractive alternative for solving the problem in all its aspects including the determination of parasitic effects. A problem of practical interest, related to crosstalk, is formulated to be solved using the FEM. The technique is first applied to obtain the field distribution, and then the field is used to calculate transmission line parameters of conducting tracks on printed circuit boards. FEM is used to solve a radiation problem in three dimensions. The solution is used to predict far-field radiation levels of electronic equipment from near-field measurements.
Keywords :
crosstalk; electromagnetic compatibility; finite element analysis; printed circuit design; EM compatibility; EMC problems; PCB; conducting tracks; crosstalk; design parameters; electronic equipment; far-field radiation; field distribution; finite element method; near-field measurements; printed circuit board environment; radiation problem; solution domain; transmission line parameters; Boundary conditions; Capacitance; Circuit testing; Crosstalk; Electromagnetic compatibility; Electronic equipment; Finite element methods; Laplace equations; Printed circuits; Transmission line matrix methods;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/15.229423
Filename :
229423
Link To Document :
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