Title :
Finite-element method applied to EMC problems (PCB environment)
Author :
Laroussi, R. ; Costache, G.I.
Author_Institution :
Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
fDate :
5/1/1993 12:00:00 AM
Abstract :
In a printed circuit board environment, the solution domain is highly inhomogeneous, and analytic expressions for design parameters are very difficult to obtain, even for the simplest configuration. The finite element method (FEM) offers an attractive alternative for solving the problem in all its aspects including the determination of parasitic effects. A problem of practical interest, related to crosstalk, is formulated to be solved using the FEM. The technique is first applied to obtain the field distribution, and then the field is used to calculate transmission line parameters of conducting tracks on printed circuit boards. FEM is used to solve a radiation problem in three dimensions. The solution is used to predict far-field radiation levels of electronic equipment from near-field measurements.
Keywords :
crosstalk; electromagnetic compatibility; finite element analysis; printed circuit design; EM compatibility; EMC problems; PCB; conducting tracks; crosstalk; design parameters; electronic equipment; far-field radiation; field distribution; finite element method; near-field measurements; printed circuit board environment; radiation problem; solution domain; transmission line parameters; Boundary conditions; Capacitance; Circuit testing; Crosstalk; Electromagnetic compatibility; Electronic equipment; Finite element methods; Laplace equations; Printed circuits; Transmission line matrix methods;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on