A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers

Author

Zhang, Y.P. ; Li, X.J. ; Phang, T.Y.

Author_Institution

Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore

Volume

29

Issue

2

fYear

2006

fDate

5/1/2006 12:00:00 AM

Firstpage

354

Lastpage

358

Abstract

This paper presents a study of a dual-mode bandpass filter integrated in a ball grid array (BGA) package for the single-chip solutions of radio frequency (RF) transceivers. The novel in-package filter, except for the economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. The simulated and measured performance of the in-package filter is presented. The effects of the different physical parts of the package on the filter performance are investigated. Experimental results show that the in-package filter of size 15×15×1.905 mm³ achieved 3-dB percentage bandwidth of 14% and insertion loss of 2.07 dB at 5.25 GHz.

Keywords

ball grid arrays; band-pass filters; radiofrequency filters; transceivers; 2.07 dB; 5.25 GHz; BGA package; ball grid array package; dual-mode bandpass filter; filter performance; in-package filter; insertion loss; radio frequency transceivers; single-chip RF transceivers; Band pass filters; CMOS technology; Ceramics; Electronics packaging; Insertion loss; Integrated circuit packaging; Multichip modules; Radio frequency; Resonator filters; Transceivers; Ball grid array (BGA) packages; RF bandpass filters; single-chip radio frequency (RF) transceivers;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2006.873135

Filename

1629178