Title :
Thermal impedance testing of high-speed gate arrays
Author :
Brown, E.R. ; Beasley, K. ; Barber, W.L.
Author_Institution :
Plessey Research (Caswell) Ltd., Towcester, UK
fDate :
12/1/1985 12:00:00 AM
Abstract :
The paper describes a method for 100% testing of the thermal impedance of integrated circuits using a temperature-sensitive parameter. The approach is applicable to automated test procedures, and results are presented on its use in testing a high-speed gate array. Alternative methods for assessing thermal impedance are discussed.
Keywords :
automatic testing; cellular arrays; integrated circuit testing; integrated logic circuits; logic testing; automated test procedures; high-speed gate arrays; logic IC testing; temperature-sensitive parameter; thermal impedance;
Journal_Title :
Electronic Circuits and Systems, IEE Proceedings G
DOI :
10.1049/ip-g-1:19850055
