Comparison of methods for determining the capacitance of planar transmission lines with application to multichip module characterization

Author

Lipa, Steven ; Steer, Michael B. ; Morris, Arthur S. ; Franzon, Paul D.

Author_Institution

Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA

Volume

16

Issue

3

fYear

1993

fDate

5/1/1993 12:00:00 AM

Firstpage

247

Lastpage

252

Abstract

The techiques for determining the capacitance of embedded interconnects in an MCM-D MCM (multichip module) are compared. The error is estimating this capacitance in generally the greatest contributor to the overall error in determining the impedance of interconnects and discontinuities. Using in situ calibration microwave characterization of various MCM interconnects fabricated using an alumina on polyimide MCM-D process is reported

Keywords

capacitance measurement; integrated circuit testing; microwave measurement; multichip modules; alumina on polyimide MCM-D process; capacitance; embedded interconnects; in situ calibration; microwave characterization; multichip module characterization; planar transmission lines; Calibration; Capacitance measurement; Electrical resistance measurement; Frequency; Microwave measurements; Microwave theory and techniques; Multichip modules; Planar transmission lines; Probes; Transmission line measurements;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.232050

Filename

232050