Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn

Author

Zakel, Elke ; Reichl, Herbert

Author_Institution

Technol. der Mikroperipherik, Tech. Univ., Berlin, Germany

Volume

16

Issue

3

fYear

1993

fDate

5/1/1993 12:00:00 AM

Firstpage

323

Lastpage

332

Abstract

Works done on different Au-Sn-Cu and Au-Cu metallurgies in the inner lead bond (ILB) area is summarized. The influence of Kirkendall pore formation in the Cu-Au-Sn system as a degradation mechanism is shown. This effect, together with the formation of new types of ternary intermetallic compounds, is observed during thermal aging in contacts with a direct interface between the eutectic 80/20 Au-Sn alloy and Cu. The zeta-phase (Au/Sn 90/10) acts like a diffusion barrier, which inhibits the pore formation associated with Cu diffusion. The composition of the ternary intermetallic compounds, their growth constant, and activation energy is determined. The possibilities to increase the contact reliability by producing a reliable Au-Sn metallurgy during the ILB process are shown

Keywords

chemical interdiffusion; eutectic alloys; gold alloys; soldering; tape automated bonding; tin alloys; AuSn bonding metallurgy; Cu-AuSn; Kirkendall effect; Kirkendall pore formation; TAB contacts; activation energy; degradation mechanism; diffusion barrier; growth constant; inner lead bond area; ternary intermetallic compounds; ternay CuAuSn; thermal aging; zeta-phase; Aging; Bonding; Copper alloys; Gold; Grain boundaries; Intermetallic; Lead; Temperature distribution; Thermal degradation; Tin;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.232060

Filename

232060