Automated vision system for inspection of IC pads and bonds

Author

Sreenivasan, Koduri K. ; Srinath, Mand Yarn ; Khotanzad, Alireza

Author_Institution

Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA

Volume

16

Issue

3

fYear

1993

fDate

5/1/1993 12:00:00 AM

Firstpage

333

Lastpage

338

Abstract

One of the problems in increasing reliability in the manufacture of integrated circuit (IC) devices is inspection of the bond pads and the bonds connecting the bond pads to the lead fingers of the device. The continuing increase in packing density of VLSI circuits requires that the inspection process be completely automated. The authors present methods for visual inspection of bond pads and bonds, which are intended to automatically extract parameters of significance in determining their quality, from two-dimensional images taken from the top of the IC wafer

Keywords

VLSI; automatic optical inspection; computer vision; integrated circuit testing; IC pads; VLSI; algorithms; automated vision system; bonds; inspection; lead fingers; two-dimensional images; visual inspection; Atherosclerosis; Circuit testing; Inspection; Integrated circuit manufacture; Integrated circuit reliability; Joining processes; Machine vision; Probes; Shape; Very large scale integration;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.232061

Filename

232061