DocumentCode :
937098
Title :
Mechanical stability and adhesion of microstructures under capillary forces. II. Experiments
Author :
Mastrangelo, C.H. ; Hsu, C.H.
Author_Institution :
Dept. of Micro-Sensors & Actuators, Ford Motor Co., Dearborn, MI, USA
Volume :
2
Issue :
1
fYear :
1993
fDate :
3/1/1993 12:00:00 AM
Firstpage :
44
Lastpage :
55
Abstract :
For pt.I see ibid., vol.2, p. 33 (1993). Strong capillary forces are developed in the fabrication process of surface micromachined structures during the wet etch of sacrificial layers. The magnitude of these forces is in some cases sufficient to deform and pin these structures to the substrate resulting in device failure. The deflection, mechanical stability, and adhesion of thin micromechanical structure under capillary forces are examined. Microstructure adhesion is considered and experimental data for polycrystalline silicon microstructures are presented
Keywords :
adhesion; capillarity; elemental semiconductors; etching; mechanical stability; micromechanical devices; silicon; Si; Si microstructures; adhesion; capillary forces; deflection; elemental semiconductor; mechanical stability; polysilicon; sacrificial layers; surface micromachined structures; thin micromechanical structure; wet etch; wet etching; Actuators; Adhesives; Helium; Laboratories; Micromotors; Microstructure; Silicon; Solids; Stability; Wet etching;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/84.232594
Filename :
232594
Link To Document :
بازگشت