DocumentCode
937123
Title
Fabrication of submicron high-aspect-ratio GaAs actuators
Author
Zhang, Z. Lisa ; MacDonald, Noel C.
Author_Institution
Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
Volume
2
Issue
2
fYear
1993
fDate
6/1/1993 12:00:00 AM
Firstpage
66
Lastpage
73
Abstract
Submicron, single-crystal gallium arsenide (SC-GaAs) actuators have been designed, fabricated, and operated. The fabrication process, called SCREAM-II (single crystal reactive etching and metallization II), uses chemically assisted ion beam etching (CAIBE) and reactive ion etching (RIE) to produce suspended and movable SC-GaAs structures with up to a 25:1 aspect ratio of vertical depth (10 μm) to lateral width (400 nm). Integrated actuators with predominantly vertical sidewall (PVS) aluminum electrodes are used to move the structures. Silicon nitride is used as an etch mask, structural stiffener, and electrical insulator. An x -y stage with integrated actuators produces controllable x -y displacements of ±1.8 μm when a voltage of 54.5 V is applied to either or both of the x and y actuators. The x -y stage resonates for an applied sinewave of 20 V (peak to peak) with f =10.5 kHz and a DC offset of 10 V. The structural vibration amplitude is 0.6 μm
Keywords
III-V semiconductors; electric actuators; gallium arsenide; metallisation; micromechanical devices; semiconductor technology; sputter etching; -1.8 to 1.8 micron; 54.5 V; GaAs actuators; GaAs substrate; SCREAM-II; Si3N4 etch mask; chemically assisted ion beam etching; controllable x-y displacements; electrical insulator; fabrication process; high-aspect-ratio; reactive ion etching; single crystal reactive etching; structural stiffener; submicron devices; vertical sidewall Al electrodes; x-y stage; Actuators; Aluminum; Chemical processes; Electrodes; Etching; Fabrication; Gallium arsenide; Ion beams; Metallization; Silicon;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/84.232602
Filename
232602
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