• DocumentCode
    937123
  • Title

    Fabrication of submicron high-aspect-ratio GaAs actuators

  • Author

    Zhang, Z. Lisa ; MacDonald, Noel C.

  • Author_Institution
    Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
  • Volume
    2
  • Issue
    2
  • fYear
    1993
  • fDate
    6/1/1993 12:00:00 AM
  • Firstpage
    66
  • Lastpage
    73
  • Abstract
    Submicron, single-crystal gallium arsenide (SC-GaAs) actuators have been designed, fabricated, and operated. The fabrication process, called SCREAM-II (single crystal reactive etching and metallization II), uses chemically assisted ion beam etching (CAIBE) and reactive ion etching (RIE) to produce suspended and movable SC-GaAs structures with up to a 25:1 aspect ratio of vertical depth (10 μm) to lateral width (400 nm). Integrated actuators with predominantly vertical sidewall (PVS) aluminum electrodes are used to move the structures. Silicon nitride is used as an etch mask, structural stiffener, and electrical insulator. An x-y stage with integrated actuators produces controllable x-y displacements of ±1.8 μm when a voltage of 54.5 V is applied to either or both of the x and y actuators. The x-y stage resonates for an applied sinewave of 20 V (peak to peak) with f=10.5 kHz and a DC offset of 10 V. The structural vibration amplitude is 0.6 μm
  • Keywords
    III-V semiconductors; electric actuators; gallium arsenide; metallisation; micromechanical devices; semiconductor technology; sputter etching; -1.8 to 1.8 micron; 54.5 V; GaAs actuators; GaAs substrate; SCREAM-II; Si3N4 etch mask; chemically assisted ion beam etching; controllable x-y displacements; electrical insulator; fabrication process; high-aspect-ratio; reactive ion etching; single crystal reactive etching; structural stiffener; submicron devices; vertical sidewall Al electrodes; x-y stage; Actuators; Aluminum; Chemical processes; Electrodes; Etching; Fabrication; Gallium arsenide; Ion beams; Metallization; Silicon;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/84.232602
  • Filename
    232602