• DocumentCode
    937882
  • Title

    Parametric modeling of integrated circuit interconnections

  • Author

    Siomacco, Edward M. ; Tummala, Murali

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Naval Postgraduate Sch., Monterey, CA, USA
  • Volume
    39
  • Issue
    6
  • fYear
    1992
  • fDate
    6/1/1992 12:00:00 AM
  • Firstpage
    377
  • Lastpage
    382
  • Abstract
    A parametric approach to the modeling and characterization of high frequency losses and dispersive propagation on integrated-circuit (IC) interconnections is presented. An autoregressive moving-average (ARMA) model based on a lumped equivalent circuit of a lossy microstrip transmission line is proposed. Model parameters are estimated from on-wafer time-domain measurements using a weighted least squares (WLS) algorithm and an Elmore delay approximation technique. It is shown that the effective microstrip permittivity can be evaluated from the estimated ARMA model parameters. Experiment results are compared with computer simulations of the lumped equivalent circuit and ARMA parametric models
  • Keywords
    digital integrated circuits; equivalent circuits; integrated circuit technology; parameter estimation; semiconductor device models; strip lines; ARMA parametric models; Elmore delay approximation; IC interconnect; MMIC; WLS algorithm; autoregressive moving-average; dispersive propagation; effective microstrip permittivity; high frequency losses; high speed digital circuits; integrated circuit interconnections; lossy microstrip transmission line; lumped equivalent circuit; model parameters; on-wafer time-domain measurements; weighted least squares; Delay estimation; Equivalent circuits; Frequency; Integrated circuit interconnections; Integrated circuit modeling; Least squares approximation; Microstrip; Parameter estimation; Parametric statistics; Propagation losses;
  • fLanguage
    English
  • Journal_Title
    Circuits and Systems II: Analog and Digital Signal Processing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1057-7130
  • Type

    jour

  • DOI
    10.1109/82.145295
  • Filename
    145295