• DocumentCode
    938567
  • Title

    Influence of copper vapor contamination on dielectric properties of hot air at 300-3500 K in atmospheric pressure

  • Author

    Tanaka, Yasunori

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Kanazawa Univ., Japan
  • Volume
    12
  • Issue
    3
  • fYear
    2005
  • fDate
    6/1/2005 12:00:00 AM
  • Firstpage
    504
  • Lastpage
    512
  • Abstract
    The influence of copper vapor contamination on the dielectric properties of hot air at atmospheric pressure was numerically predicted in heavy particle temperature range 300-3500 K. Dielectric properties of hot gases are very important for effective design of switching devices and other applications. Copper vapor is known to be injected from the electrodes into the hot gas during arc interruption in a circuit breaker, which may substantially affect the dielectric strength of the hot gas. Analysis of equilibrium composition for a hot air contaminated with copper vapor and computations of Boltzmann equation made it possible to study the dielectric properties of interest. The result indicates that 1.0% copper vapor contamination remarkably increases the effective ionization coefficient α~ and thereby decreases the critical electric field (E/N)cr drastically. This arises from a much lower ionization potential of the copper atom.
  • Keywords
    Boltzmann equation; atmospheric pressure; circuit-breaking arcs; contamination; copper; dielectric properties; electric fields; electric strength; electrodes; ionisation potential; switching; 300 to 3500 K; Boltzmann equation; arc interruption; atmospheric pressure; circuit breaker; copper contamination; critical electric field; dielectric properties; dielectric strength; electrodes; ionization coefficient; ionization potential; switching devices; Boltzmann equation; Circuit breakers; Contamination; Copper; Dielectric breakdown; Dielectric devices; Electrodes; Gases; Ionization; Temperature distribution;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2005.1453455
  • Filename
    1453455