• DocumentCode
    939404
  • Title

    Is System in Package the Panacea for Integration?

  • Author

    Mak, T.M.

  • Author_Institution
    Intel
  • Volume
    23
  • Issue
    3
  • fYear
    2006
  • Firstpage
    256
  • Lastpage
    256
  • Abstract
    With technology scaling, nature has not been kind to conventional analog circuit design. System in package seems the obvious way to go. But its predecessor was the multichip module, and basically, all the problems are still there. The author discusses where to go from here.
  • Keywords
    SiP; System in Package; integration; Packaging; Testing; SiP; System in Package; integration;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/MDT.2006.76
  • Filename
    1634302
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=939404