DocumentCode
939740
Title
A Power Delivery and Decoupling Network Minimizing Ohmic Loss and Supply Voltage Variation in Silicon Nanoscale Technologies
Author
Budnik, Mark M. ; Roy, Kaushik
Author_Institution
Dept. of Electr. & Comput. Eng., Valparaiso Univ., IN
Volume
14
Issue
12
fYear
2006
Firstpage
1336
Lastpage
1346
Abstract
di/dt and IR events may cause large supply voltage variations and ohmic losses due to system parasitics. Today, decoupling capacitance is used to minimize the supply voltage variation, and parallelism in the power delivery path is used to reduce ohmic loss. Future integrated circuits, however, will exhibit large enough currents and current transients to mandate additional safeguards. A novel, distributed power delivery and decoupling network is introduced that reduces the supply voltage variation magnitude by more than 66% or the future ohmic loss by more than 27% (compared to today´s power delivery and decoupling networks) using conventional processing and packaging techniques
Keywords
integrated circuit design; microprocessor chips; nanotechnology; power supply circuits; voltage control; dc-dc power conversion; decoupling capacitance; integrated circuits; ohmic loss; power delivery network; power delivery path; power supplies; silicon nanoscale technologies; supply voltage variation; system parasitics; voltage control; Circuits; DC-DC power converters; Energy consumption; Intelligent networks; Microprocessors; Packaging; Parasitic capacitance; Resonant frequency; Silicon; Voltage control; Capacitor switching; dc-dc power conversion; power supplies; voltage control;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2006.887810
Filename
4052341
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