Title :
A Power Delivery and Decoupling Network Minimizing Ohmic Loss and Supply Voltage Variation in Silicon Nanoscale Technologies
Author :
Budnik, Mark M. ; Roy, Kaushik
Author_Institution :
Dept. of Electr. & Comput. Eng., Valparaiso Univ., IN
Abstract :
di/dt and IR events may cause large supply voltage variations and ohmic losses due to system parasitics. Today, decoupling capacitance is used to minimize the supply voltage variation, and parallelism in the power delivery path is used to reduce ohmic loss. Future integrated circuits, however, will exhibit large enough currents and current transients to mandate additional safeguards. A novel, distributed power delivery and decoupling network is introduced that reduces the supply voltage variation magnitude by more than 66% or the future ohmic loss by more than 27% (compared to today´s power delivery and decoupling networks) using conventional processing and packaging techniques
Keywords :
integrated circuit design; microprocessor chips; nanotechnology; power supply circuits; voltage control; dc-dc power conversion; decoupling capacitance; integrated circuits; ohmic loss; power delivery network; power delivery path; power supplies; silicon nanoscale technologies; supply voltage variation; system parasitics; voltage control; Circuits; DC-DC power converters; Energy consumption; Intelligent networks; Microprocessors; Packaging; Parasitic capacitance; Resonant frequency; Silicon; Voltage control; Capacitor switching; dc-dc power conversion; power supplies; voltage control;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2006.887810