• DocumentCode
    939740
  • Title

    A Power Delivery and Decoupling Network Minimizing Ohmic Loss and Supply Voltage Variation in Silicon Nanoscale Technologies

  • Author

    Budnik, Mark M. ; Roy, Kaushik

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Valparaiso Univ., IN
  • Volume
    14
  • Issue
    12
  • fYear
    2006
  • Firstpage
    1336
  • Lastpage
    1346
  • Abstract
    di/dt and IR events may cause large supply voltage variations and ohmic losses due to system parasitics. Today, decoupling capacitance is used to minimize the supply voltage variation, and parallelism in the power delivery path is used to reduce ohmic loss. Future integrated circuits, however, will exhibit large enough currents and current transients to mandate additional safeguards. A novel, distributed power delivery and decoupling network is introduced that reduces the supply voltage variation magnitude by more than 66% or the future ohmic loss by more than 27% (compared to today´s power delivery and decoupling networks) using conventional processing and packaging techniques
  • Keywords
    integrated circuit design; microprocessor chips; nanotechnology; power supply circuits; voltage control; dc-dc power conversion; decoupling capacitance; integrated circuits; ohmic loss; power delivery network; power delivery path; power supplies; silicon nanoscale technologies; supply voltage variation; system parasitics; voltage control; Circuits; DC-DC power converters; Energy consumption; Intelligent networks; Microprocessors; Packaging; Parasitic capacitance; Resonant frequency; Silicon; Voltage control; Capacitor switching; dc-dc power conversion; power supplies; voltage control;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2006.887810
  • Filename
    4052341