DocumentCode :
940073
Title :
On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages
Author :
Goswami, Arindam ; Han, Bongtae
Author_Institution :
Maryland Univ., College Park
Volume :
31
Issue :
1
fYear :
2008
Firstpage :
14
Lastpage :
21
Abstract :
Theoretical and practical ranges of leak rates measurable by the helium mass spectrometer are characterized. The effect of noise due to: 1) background helium present in the spectrometer and 2) desorption of helium that attaches itself to the specimen surface during bombing is quantified experimentally. The results guide a framework to extract the true leak rate from the measured leak rate profile. An optical interferometry based hermeticity measurement technique for ultra-fine leaks is proposed. The setup to implement the technique is described and a preliminary experimental result is reported.
Keywords :
leak detection; wafer level packaging; hermetic wafer level packages; optical interferometry; ultra-fine leak detection; Helium fine leak test; hermeticity; optical interferometry; theoretical and practical limits; true leak rate;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2007.906385
Filename :
4358053
Link To Document :
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