Title :
Integrated antennas on silicon substrates for communication over free space
Author :
Lin, Jau-Jr ; Gao, Li ; Sugavanam, Aravind ; Guo, Xiaoling ; Li, Ran ; Brewer, Joe E. ; O, K.K.
Author_Institution :
Silicon Microwave Integrated Circuits & Syst. Res. Group, Univ. of Florida, Gainesville, FL, USA
fDate :
4/1/2004 12:00:00 AM
Abstract :
This letter reports the feasibility of using 2-mm-long on-chip antennas for communication over free space. Integration of antennas into radio frequency integrated circuits (RFICs) eliminates external transmission line connections and sophisticated packaging, which should lower the cost of wireless systems operating above 10 GHz. Mobile microwave probe stands have been developed for measurements at varying antenna pair separations. Antenna-pair gains for 2-mm-long integrated zigzag dipole antennas fabricated on 20-Ω-cm silicon substrates have been characterized near 24 GHz for separations up to 15 m. The antenna-pair gains show R-2 dependence up to ∼4-5 m. The antennas were found to be sufficient for use up to 5 m and possibly larger separations.
Keywords :
dipole antennas; microwave antennas; radiofrequency integrated circuits; 24 GHz; RFIC; Si; antenna pair separations; free space communication; integrated antennas; integrated zigzag dipole antennas; mobile microwave probe stands; on-chip antennas; radio frequency integrated circuits; silicon substrates; wireless systems; Costs; Dipole antennas; Distributed parameter circuits; Integrated circuit packaging; Microwave communication; Mobile communication; Probes; Radiofrequency integrated circuits; Silicon; Transmission line antennas;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2004.824837
